HDI板(ban)(ban)（High Density Interconnector），即高密(mi)度互連(lian)(lian)板(ban)(ban)，是使(shi)(shi)用(yong)微盲埋孔技術的(de)(de)一(yi)種線(xian)路(lu)分布密(mi)度比較高的(de)(de)電(dian)路(lu)板(ban)(ban)。HDI板(ban)(ban)有內層(ceng)(ceng)線(xian)路(lu)和(he)外(wai)層(ceng)(ceng)線(xian)路(lu)，再利(li)用(yong)鉆孔、孔內金屬化(hua)等工藝，使(shi)(shi)各(ge)層(ceng)(ceng)線(xian)路(lu)內部實現連(lian)(lian)結。HDI板(ban)(ban)一(yi)般采用(yong)積(ji)(ji)層(ceng)(ceng)法制造，積(ji)(ji)層(ceng)(ceng)的(de)(de)次(ci)數越多，板(ban)(ban)件的(de)(de)技術檔(dang)次(ci)越高。

普通的(de)(de)HDI板(ban)基本上(shang)是1次(ci)積層，高階HDI采(cai)用2次(ci)或(huo)以上(shang)的(de)(de)積層技術，同時采(cai)用疊孔(kong)(kong)(kong)、電鍍填孔(kong)(kong)(kong)、激光直(zhi)接打孔(kong)(kong)(kong)等(deng)先進PCB技術。 在HDI硬(ying)板(ban)鉆孔(kong)(kong)(kong)領域，武漢銥科賽也(ye)布(bu)局了關鍵#，采(cai)用完全不同的(de)(de)思想完成HDI盲孔(kong)(kong)(kong)鉆孔(kong)(kong)(kong)，本公司今年將(jiang)大力(li)推進HDI硬(ying)板(ban)鉆孔(kong)(kong)(kong)設備(bei)的(de)(de)開(kai)發(fa)，直(zhi)接替代進口HDI硬(ying)板(ban)盲孔(kong)(kong)(kong)鉆孔(kong)(kong)(kong)設備(bei)，開(kai)辟公司下一個戰略支撐點。